Thank you for taking an interest in the various Microcircuit Memory components that we offer here on ASAP Military Parts, such as those listed with NSN 5962005840669. The particular item that you have taken an interest in is listed alongside the part number 31L01DM, having been manufactured by Advanced Micro Devices Inc. With current availability for this product, we encourage you to utilize our online RFQ forms to quickly and easily request quotes for your comparisons. Within 15 minutes of us receiving a completed request and reviewing your provided details, a member of our staff will reach out to you to present a tailored solution.
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To make the part procurement process as simple as possible, we choose to list all offerings with as many details as we can to ensure that you find exactly what you require with ease. For example, with the NSN 5962-00-584-0669, one can determine that part number 31L01DM belongs to FSC 5962 Microcircuits Electronic. Furthermore, its manufacturer Advanced Micro Devices Inc specifically produced this part under CAGE Code 34335, allowing you to know the exact facility it traces back to. If you are ready to begin procurement for part number 31L01DM, send us a completed RFQ form today. You may also give us a call or email at any time, and we would be more than happy to assist you however we can as your strategic sourcing partner!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-584-0669 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 005840669 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | U | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
AM31L01ADM | 1 | 9 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND LOW POWER AND SCHOTTKY AND W/BUFFERED OUTPUT AND EXPANDABLE AND W/OPEN COLLECTOR AND W/STORAGE AND WIRE-OR OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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