Thank you for taking an interest in the various Microcircuit Memory components that we offer here on ASAP Military Parts, such as those listed with NSN 5962013020502. The particular item that you have taken an interest in is listed alongside the part number CY6116-55LMB, having been manufactured by Cypress Semiconductor Inc. With current availability for this product, we encourage you to utilize our online RFQ forms to quickly and easily request quotes for your comparisons. Within 15 minutes of us receiving a completed request and reviewing your provided details, a member of our staff will reach out to you to present a tailored solution.
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To make the part procurement process as simple as possible, we choose to list all offerings with as many details as we can to ensure that you find exactly what you require with ease. For example, with the NSN 5962-01-302-0502, one can determine that part number CY6116-55LMB belongs to FSC 5962 Microcircuits Electronic. Furthermore, its manufacturer Cypress Semiconductor Inc specifically produced this part under CAGE Code 65786, allowing you to know the exact facility it traces back to. If you are ready to begin procurement for part number CY6116-55LMB, send us a completed RFQ form today. You may also give us a call or email at any time, and we would be more than happy to assist you however we can as your strategic sourcing partner!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-302-0502 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013020502 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT6116SA55L28B | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CRHL | BIT QUANTITY | 16384 |
| CSWJ | WORD QUANTITY | 2048 |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES REVERSE CURRENT,DC ABSOLUTE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
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