Thank you for taking an interest in the various Microcircuit Memory components that we offer here on ASAP Military Parts, such as those listed with NSN 5962012485010. The particular item that you have taken an interest in is listed alongside the part number DEL1403N-70LM, having been manufactured by Sgs Thompson Microelectronics Inc. With current availability for this product, we encourage you to utilize our online RFQ forms to quickly and easily request quotes for your comparisons. Within 15 minutes of us receiving a completed request and reviewing your provided details, a member of our staff will reach out to you to present a tailored solution.
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To make the part procurement process as simple as possible, we choose to list all offerings with as many details as we can to ensure that you find exactly what you require with ease. For example, with the NSN 5962-01-248-5010, one can determine that part number DEL1403N-70LM belongs to FSC 5962 Microcircuits Electronic. Furthermore, its manufacturer Sgs Thompson Microelectronics Inc specifically produced this part under CAGE Code 60911, allowing you to know the exact facility it traces back to. If you are ready to begin procurement for part number DEL1403N-70LM, send us a completed RFQ form today. You may also give us a call or email at any time, and we would be more than happy to assist you however we can as your strategic sourcing partner!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-248-5010 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012485010 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT6167L70LB | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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